More than 700 top specialists from 60 countries attended the 3rd European Conference on Earthquake Engineering and Seismology (3ECEES)

In the period between September 4–9 2022 the Capital city hosted one of the world’s leading scientific events, which was organised by The Romanian Association for Earthquake Engineering, with the support of The Technical University of Civil Engineering of Bucharest (UTCB) and The National Institute for Earth Physics (INFP).

Throughout the 6 days of the European Conference on Earthquake Engineering and Seismology (3ECEES) event, top specialists from all over the world discussed salient and globally relevant topics from the Earthquake Engineering and Seismology fields.

The conference provided a creative and stimulating environment for numerous fruitful discussions among top representatives from the research, engineering and academic fields as well as relevant representatives from the construction field, who shared the latest studies and breakthroughs with the aim of identifying means of seismic risk reduction at the same time with promoting Earthquake Engineering and Seismology with the purpose of attaining enhanced societal seismic resilience.

The Conference also included an exhibition area, where participants from all over the world presented their latest technologies, accomplishments and approaches in the Earthquake Engineering and Seismology fields. Among the international participants in the Fair were names such as: Eentec (USA), Geobit (Greece), GERB (Germany), Güralp (UK), ISAAC (Italy), Kinemetrics (USA), Spektra (Germany), TDG (Turkey). The full list of exhibitors can be viewed here.

The high-level event was held under the High Patronage of the President of Romania, Klaus Iohannis.

Sponsors of this year’s edition of the European Conference on Earthquake Engineering and Seismology were SCC Erbașu (Platinum), Kinemetrics (Gold), Spektra (Silver) and Progetto Sisma (Silver). The event was supported as media partners by: New Money, Business-Review, Wall-Street.ro and 9am.ro.